{"id":60151,"date":"2022-02-09T14:07:29","date_gmt":"2022-02-09T14:07:29","guid":{"rendered":"https:\/\/pr.asianetpakistan.com\/?p=86660"},"modified":"2022-02-09T14:07:29","modified_gmt":"2022-02-09T14:07:29","slug":"lam-research-introduces-groundbreaking-suite-of-selective-etch-tools-to-accelerate-chipmakers-3d-roadmaps","status":"publish","type":"post","link":"https:\/\/indonesiatribune.com\/lam-research-introduces-groundbreaking-suite-of-selective-etch-tools-to-accelerate-chipmakers-3d-roadmaps\/","title":{"rendered":"Lam Research Introduces Groundbreaking Suite of Selective Etch Tools to Accelerate Chipmakers\u2019 3D Roadmaps"},"content":{"rendered":"
\n

New Portfolio Leapfrogs the Competition with Innovative Etch Techniques and Chemistries to Support Development of Advanced Logic and Memory Solutions<\/h4>\n
\n
\n
Lam Research Introduces Groundbreaking Suite of Selective Etch Tools to Accelerate Chipmakers\u2019 3D Roadmaps<\/h5>\n<\/div>\n
\n
\n
\"\"<\/a><\/p>\n

Lam Research\u2019s selective etch portfolio provides a powerful advantage in the design and manufacture of advanced logic and memory semiconductor solutions. Prevos\u2122 and Selis\u00ae (pictured) can be delivered as a single, integrated tool to provide unique multi-layer selective etching, improved queue-time control, and maximum production flexibility.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n

FREMONT, Calif., Feb. 09, 2022 (GLOBE NEWSWIRE) — Lam Research Corp. (NASDAQ: LRCX) today announced a new suite of selective etch products that apply breakthrough wafer fabrication techniques and novel chemistries to support chipmakers in the development of gate-all-around (GAA) transistor structures. Composed of three new products \u2013 Argos\u00ae, Prevos\u2122 and Selis\u00ae \u2013 Lam\u2019s selective etch portfolio provides a powerful advantage in the design and manufacture of advanced logic and memory semiconductor solutions.<\/p>\n

As modern technologies and devices continue to evolve, the need for greater device density for improved performance and efficiency increases. To keep pace with Moore\u2019s Law, chipmakers are now developing transistor structures vertically \u2013 an exceptionally complex process that requires ultra-high selectivity, precision etching and uniform isotropic removal of material without modifying or causing damage to other critical material layers.<\/p>\n

\n
Lam Research Introduces Groundbreaking Suite of Selective Etch Tools to Accelerate Chipmakers\u2019 3D Roadmaps<\/h5>\n
\"\"<\/a><\/p>\n

An engineer with a chamber for Lam Research’s Selis\u00ae, a product in its selective etch portfolio. Selis uniquely employs both radical and thermal etch capabilities to enable ultra-high selective etching with uniform top to bottom process control without causing damage to the wafer structure.<\/p>\n<\/div>\n<\/div>\n

Lam\u2019s selective etch solutions provide the ultra-high, tunable selectivity and damage-free material removal required to support advanced logic nanosheet or nanowire formation, enabling chipmakers to make the next evolutionary leap from planar to three-dimensional structures for DRAM as it reaches its planar scaling limit.<\/p>\n

Developed in collaboration with the world\u2019s most innovative logic and foundry chipmakers, Lam\u2019s selective etch products are already being used in the fabs of industry leaders like Samsung Electronics to support nearly a dozen critical steps in the advanced logic wafer development process.<\/p>\n

\u201cThe semiconductor industry is continuously driven toward more powerful and faster device capability. <\/em>As the density and complexity of the devices have been increasing significantly, selective etch technology is critical to manufacturing our most advanced logic device,\u201d said Dr. Keun Hee Bai, Master of Semiconductor R&D Center at Samsung. \u201cAs global demand for Samsung\u2019s technologies continues to soar, we rely on the extensive innovation and capabilities of selective etch to bolster production and accelerate our logic device roadmap toward advanced logic GAA and beyond.\u201d<\/p>\n

The Lam selective etch portfolio is composed of three new tools:<\/p>\n